Silicon-based products and solutions

被引：3

作者：

Painchaud, Y. ^{[1
]}

Poulin, M. ^{[1
]}

Pelletier, F. ^{[1
]}

Latrasse, C. ^{[1
]}

Gagne, J. -F. ^{[1
]}

Savard, S. ^{[1
]}

Robidoux, G. ^{[1
]}

Picard, M. -J. ^{[1
]}

Paquet, S. ^{[1
]}

Davidson, C. -A. ^{[1
]}

Pelletier, M. ^{[1
]}

Cyr, M. ^{[1
]}

Paquet, C. ^{[1
]}

Guy, M. ^{[1
]}

Morsy-Osman, M. ^{[2
]}

Chagnon, M. ^{[2
]}

Plant, D. V. ^{[2
]}

机构：

[1] TeraXion, 2716 Einstein, Quebec City, PQ G1P 4S8, Canada

[2] McGill Univ, Dept Elect & Comp Engn, Montreal, PQ H3A 2A7, Canada

来源：

INTEGRATED OPTICS: DEVICES, MATERIALS, AND TECHNOLOGIES XVIII | 2014年 / 8988卷

关键词：

Silicon photonics; integrated optics; integrated photonics; receiver; coherent detection; modulator; packaging; MODULATOR; VOLTAGE; COUPLER;

D O I：

10.1117/12.2036355

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

TeraXion started silicon photonics activities aiming at developing building blocks for new products and customized solutions. Passive and active devices have been developed including MMI couplers, power splitters, Bragg grating filters, high responsivity photodetectors, high speed modulators and variable optical attenuators. Packaging solutions including fiber attachment and hybrid integration using flip- chip were also developed. More specifically, a compact packaged integrated coherent receiver has been realized. Good performances were obtained as demonstrated by our system tests results showing transmission up to 4800 km with BER below hard FEC threshold. The package size is small but still limited by the electrical interface. Migrating to more compact RF interface would allow realizing the full benefit of this technology.

引用

页数：14

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