Interface evolution analysis of graded thermoelectric materials joined by low temperature sintering of nano-silver paste

被引：15
|
作者：
Li, Huayi [1 ,2 ]
Jing, Hongyang [1 ,3 ,4 ]
Han, Yongdian [3 ,4 ]
Lu, Guo-Quan [3 ,4 ]
Xu, Lianyong [3 ,4 ]
Liu, Tun [3 ,4 ]
机构：
[1] Tianjin Univ Technol, Sch Elect Informat Engn, Tianjin 300384, Peoples R China
[2] Tianjin Key Lab Film Elect & Commun Devices, Tianjin 300384, Peoples R China
[3] Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300072, Peoples R China
[4] Tianjin Key Lab Adv Joining Technol, Tianjin 300072, Peoples R China
来源：
JOURNAL OF ALLOYS AND COMPOUNDS | 2016年 / 659卷
基金：
中国国家自然科学基金; 高等学校博士学科点专项科研基金;
关键词：
Thermoelectric materials; Interface diffusion; Low-temperature joining technique; Aging test; OPTIMIZATION; DEVICES; COUPLES;
D O I：
10.1016/j.jallcom.2015.11.057
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Lead free solder Sn96.5Ag3.0Cu0.5 (SAC305) and nano-silver paste were used to connect graded thermoelectric (TE) arms, respectively. A series of harsh aging tests were carried out on joints of both p-type and n-type graded TE arms. The results showed that nano-silver paste printed by low-temperature joining technique was much more suitable for the stable connection of TE materials working in medium temperature range. 316 stainless steel and nickel were proved effectively as diffusion barrier layers in p-type junctions. While for n-type TE junctions, when aging at 300 degrees C, (Fe, Cr, Te) ternary alloy could be detected at Bi2Te2.7Se0.3/316 stainless steel interface. The formation of ternary compound realized fine metallurgical interconnection which was benefit for the improvement of joint strength. The average joint strength for p-type and n-type junctions in graded TE arms were above 20 MPa and 30 MPa, respectively. (C) 2015 Elsevier B.V. All rights reserved.
引用
收藏
页码：95 / 100
页数：6
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