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- [1] VUV/O3 activated bonder for low-temperature direct bonding of Si-based materials 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 1448 - 1452
- [3] Room-Temperature Bonding and Debonding of Glass and Polystyrene Substrates Based on VUV/O3 Activated Bonding Method 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 1453 - 1456
- [4] High Temperature Performance Over 700°C of LiNbO3-Based Ultrasonic Transducer 2022 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IEEE IUS), 2022,
- [5] A study on low temperature SAM modified POM direct bonding affected by VUV/O3 irradiation 2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2017, : 69 - 69
- [8] Mechanisms for low-temperature direct bonding of Si/Si and quartz/quartz via VUV/O3 activation RSC ADVANCES, 2018, 8 (21): : 11528 - 11535