A system design approach to liquid-cooled microprocessors

被引:1
|
作者
Dickinson, RD [1 ]
Novotny, S [1 ]
Vogel, M [1 ]
Dunn, J [1 ]
机构
[1] ThermoNESLAB, Portsmouth, NH 03802 USA
关键词
micro-channel; thermal resistance; heat transfer; heatsink; pump reliability;
D O I
10.1109/ITHERM.2002.1012486
中图分类号
O414.1 [热力学];
学科分类号
摘要
This paper describes a compact fluid-cooled computer system, comprised of micro-channel heat exchangers, a fan, and a small pump, to remove heat from a microprocessor. Computational fluid dynamic analysis was used to determine the optimal micro-channel fin array design. Normal flow heat exchanger (NFHX) and parallel flow heat exchanger (PFHX) designs were evaluated. Due to packaging constraints, a micro-channel radiator was used. Integral to the radiator design was the selection of a reliable 30 SCFM blower. Fluid flow and pressure requirements were on the order of 0.5 LPM and 4 PSID respectively. The cooling system developed provided a heatsink to air thermal resistance of 0.155degreesC/W. An understanding was developed of the effect of airflow, liquid-flow, and heatload on the system performance leading to work which would achieve a heatsink to air thermal resistance of 0.100 degreesC/W and lower.
引用
收藏
页码:413 / 420
页数:8
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