Accelerated testing and finite element analysis of PBGA under multiple environmental loadings

被引：10
|
作者：
Qi, HY [1 ]
Ganesan, S [1 ]
Osterman, M [1 ]
Pecht, M [1 ]
机构：
[1] Univ Maryland, CALCE Elect Prod & Syst Ctr, College Pk, MD 20742 USA
来源：
2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS | 2004年
关键词：
D O I：
10.1109/BEPRL.2004.1308157
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
To investigate the long term reliability of plastic ball grid array (PBGA) packages in aerospace application, accelerated tests were conducted to non-underfilled and underfilled packages under multimple environmental loadings at board level. This paper discusses the test results and the undefill effect on solder joint reliability. Failure mode and site were identified through failure analysis on test samples. To better understand the thermomechanical behavior of PBGA under cyclic thermal loading environments, three dimensional FEA models for non-underfilled and underfilled packages were also developed and used to predict the time to failure.
引用
收藏
页码：99 / 106
页数：8
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