Diffusion of ion-implanted boron and silicon in germanium

被引:0
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作者
Uppal, S [1 ]
Willoughby, AFW [1 ]
Bonar, JM [1 ]
Cowern, NEB [1 ]
Morris, RJH [1 ]
Dowsett, MG [1 ]
机构
[1] Univ Southampton, Mat Res Grp, Sch Engn Sci, Southampton SO17 1BJ, Hants, England
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The diffusion of B and Si in Ge is studied using implantation doping. Concentration profiles after furnace annealing in the temperature range 800-900degreesC were obtained using high resolution secondary ion mass spectroscopy (SIMS). Diffusion coefficients are calculated by fitting the annealed profiles. For B, we obtain diffusivity values which axe two orders of magnitude slower than previously reported in literature. An activation energy of 4.65(+/-0.3) eV is calculated for B diffusion in Ge. The results suggest that diffusion mechanism other than vacancy should be considered for B diffusion in Ge. For Si diffusion in Ge, the diffusivity values calculated in the temperature range 750-875degreesC are in agreement with previous work. The activation energy of 3.2(+/-0.3) eV for Si diffusion is closer to that for Ge self-diffusion which suggests that Si diffusion in Ge occurs via the same mechanism as in Ge self-diffusion.
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页码:237 / 242
页数:6
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