Large-scale assembly of Cu/CuO nanowires for nano-electronic device fabrication

To improve the efficiency of nano-electronic device fabrication, a new method named floating electrical potential assembly is proposed to realize large-scale assembly of Cu/CuO nanowires. The simulation of floating electrical potential distribution on the micro-electrode chip is performed by COMSOL software, and the simulation result shows that the coupled electrical potential on the floating drain electrodes is very close to the original electrical potential applied on the gate electrode, which means that the method can provide di-electrophoresis (DEP) force for all the electrode pairs at one time, thus realizing large-scale assembly at one time. With Cu/CuO nanowires well dispersed and micro-electrode chip fabrication, nanowires assembly experiments are performed and the experimental results show that Cu/CuO nanowires are assembled at hundreds of micro-electrodes pairs at one time, and the success rate of nanowires assembly also reaches 90%.