An Efficient Hybrid Boundary-Integral and Finite-Element Method for Signal Integrity Analysis of Multiple Vias Sharing an Anti-Pad in an Infinitely-Large Plate Pair

A domain decomposition approach, namely hybrid boundary-integral and finite-element method, is proposed for signal integrity analysis of an infinitely-large plate pair with multi-vias in a shared anti-pad. Each via structure is modeled as a multi-mode network containing top/bottom transverse electromagnetic (TEM) ports associated with vias and parallel plate ports a little far away from the anti-pad. Coupling among parallel-plate ports of all via structures is considered by a plate-pair impedance matrix. The connection of the multi-mode networks of via structures and the impedance matrix constructs a complete noise coupling path from one via structure to another one, and the S-parameter of the entire plate pair can be steadily obtained by simply manipulating S-parameter matrices. Numerical examples are used to verify the accuracy of the approach by comparing with a full-wave solver.