Ultra-low energy SIMS analysis of boron deltas in silicon

被引:22
|
作者
Baboux, N
Dupuy, JC
Prudon, G
Holliger, P
Laugier, F
Papon, AM
Hartmann, JM
机构
[1] CEA DRT, LETI DTS, CEA GRE 17, F-38054 Grenoble 9, France
[2] Inst Natl Sci Appl, CNRS, UMR 5511, Lab Phys Mat, F-69621 Villeurbanne, France
关键词
secondary ion mass spectrometry; molecular beam epitaxy; reduced pressure-chemical vapor deposition; boron doping;
D O I
10.1016/S0022-0248(02)01643-3
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
Measuring depth resolution in secondary ion mass spectrometry is of crucial importance. In the case of boron in silicon, the depth resolution is frequently inspected by profiling molecular beam epitaxy (MBE) grown multi-delta-like structures. Recently, it has been shown that the quality of such samples is dependent on the growth parameters. In this paper, we show that samples grown by reduced pressure-chemical vapor deposition feature a lower dynamic range but a superior high intensity sharpness compared to MBE. Thanks to this, the depth resolution parameters reported here are excellent: the full-width at half-maximum is equal to 1.29 nm and the exponential decay length at the trailing edge to 0.64 nm for a 500 eV O-2(+) primary beam at theta = 44degrees with some oxygen flooding. We are even able to discriminate between two B deltas only 1.71 nm apart. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:1 / 8
页数:8
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