Integrated-Circuit Approaches to THz Communications: Challenges, Advances, and Future Prospects

被引：18

作者：

Fujishima, Minoru ^{[1
]}

Amakawa, Shuhei ^{[1
]}

机构：

[1] Hiroshima Univ, Grad Sch Adv Sci Matter, Higashihiroshima 7398530, Japan

来源：

IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS COMMUNICATIONS AND COMPUTER SCIENCES | 2017年 / E100A卷 / 02期

关键词：

terahertz; wireless communications; integrated circuits; WIRELESS LINK; TERAHERTZ COMMUNICATIONS; DATA-TRANSMISSION; TRANSMITTER; RECEIVER; CHIPSET; GBIT/S;

D O I：

10.1587/transfun.E100.A.516

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Frequencies around 300 GHz offer extremely broad atmospheric transmission window with relatively low losses of up to 10 dB/km and can be regarded as the ultimate platform for ultrahigh-speed wireless communications with near-fiber-optic data rates. This paper reviews technical challenges and recent advances in integrated circuits targeted at communications using these and nearby "terahertz (THz)" frequencies. Possible new applications of THz wireless links that are hard to realize by other means are also discussed.

引用

页码：516 / 523

页数：8

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