Lead-free solder flip chips on FR-4 substrates with different surface finishes, underfills and fluxes

被引：1
|
作者：
Sjoberg, J [1 ]
Geiger, DA [1 ]
Shangguan, DK [1 ]
Castello, T [1 ]
机构：
[1] Flextron, Linkoping, Sweden
来源：
29TH INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM | 2004年
关键词：
D O I：
10.1109/IEMT.2004.1321628
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This study is focused on the assembly and reliability of 200-250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impact of different PCB surface finishes (OSP and ENIG) was investigated from assembly and reliability perspectives. Different underfill materials (including an acid anhydrate based material and two non-acid anhydrate based materials) were evaluated for compatibility with the flux and lead-free solder bumps and process.
引用
收藏
页码：31 / 36
页数：6
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