Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

被引：129
|
作者：
Nogita, K. [1 ]
Gourlay, C. M. [2 ]
Nishimura, T.
机构：
[1] Osaka Univ, Suita, Osaka 565, Japan
[2] Univ London Imperial Coll Sci Technol & Med, Dept Mat, London SW7 2AZ, England
来源：
JOM | 2009年 / 61卷 / 06期
关键词：
LEAD-FREE SOLDER; INTERMETALLIC COMPOUNDS; INTERFACIAL REACTIONS; FLUIDITY LENGTH; RICH CORNER; ALLOYS; CU6SN5; MICROSTRUCTURE; SYSTEM;
D O I：
10.1007/s11837-009-0087-6
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A method of limiting cracking in the Cu(6)Sn(5) intermetallic compounds (IMCs) at the interface between lead-free solders and copper substrates has been developed. To explore the mechanism of crack inhibition in the nickel-containing IMC reaction layers, detailed synchrotron x-ray powder diffraction with Rietveld analysis and differential scanning calorimetry have been used. The results show that nickel stabilizes the high-temperature hexagonal allotrope of Cu6Sn5, avoiding stresses induced by a volumetric change that would otherwise occur on transformation to the monoclinic phase.
引用
收藏
页码：45 / 51
页数：7
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