Anodic Dissolution of Ti in EMIC-AlCl3 Ionic Liquid or LiCl-KCl Molten Salt for Enhancement of Adhesion Between Bone Cell and Ti Substrate

For application of Ti to the bio-implant materials, the anodic etching of Ti in the molten salt of LiCl-KCl and EMIC-AlCl3 was investigated. The roughness of the Ti surface after the etching was examined from the SEM observation. The etching of the Ti electrode in the melt of LiCl-KCl did not form a Suitably rough Surface morphology. In the melt, the largely rough surface was formed with top-to-bottom distance of 10 mu m. The etching in the melt of EMCI-AlCl3 at the potential of 0.6 V vs. Al/Al(III) introduced the formation of a rough Surface applicable to the Ti implant. The rough surface formed in the melt exhibits the top-to bottom distance of about 1 mu m.