The mechanical properties of electroplated Cu thin films measured by means of the bulge test technique

被引：0
|
作者：
Xiang, Y [1 ]
Chen, X [1 ]
Vlassak, JJ [1 ]
机构：
[1] Harvard Univ, Div Engn & Appl Sci, Cambridge, MA 02138 USA
来源：
THIN FILMS: STRESSES AND MECHANICAL PROPERTIES IX | 2002年 / 695卷
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D O I：
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中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The mechanical properties of freestanding electroplated Cu films were determined by measuring the deflection of Si-framed, pressurized membranes. The films were deformed under plane-strain conditions. The pressure-deflection data are converted into stress-strain curves by means of simple analytical formulae. The microstructure of the Cu films was characterized using scanning electron microscopy and x-ray diffraction. The yield stress, Young's modulus, and residual stress were determined as a function of film thickness and microstructure. Both yield stress and Young's modulus increase with decreasing film thickness and correlate well with changes in the microstructure and texture of the films.
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页码：189 / 194
页数：6
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