Chemical mechanical polishing to improve the efficiency uniformity of beam sampling grating

被引：3
|
作者：
Rao, Huanle [1 ]
Liu, Ying [1 ]
Liu, Zhengkun [1 ]
Qiu, Keqiang [1 ]
Xu, Xiangdong [1 ]
Hong, Yilin [1 ]
Fu, Shaojun [1 ]
机构：
[1] Univ Sci & Technol China, Natl Synchrotron Radiat Lab, Hefei 230029, Peoples R China
来源：
APPLIED OPTICS | 2014年 / 53卷 / 06期
基金：
中国国家自然科学基金;
关键词：
NATIONAL IGNITION FACILITY; COUPLED-WAVE ANALYSIS; DAMAGE; IMPLEMENTATION; PERFORMANCE; OPTICS; SILICA; SLURRY; GLASS; SIZE;
D O I：
10.1364/AO.53.001221
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
In order to improve the efficiency uniformity of large-aperture beam sampling gratings (BSGs), a conventional chemical mechanical polishing (CMP) process of fused silica by CeO2 slurry is proposed to modify their groove profiles. With the proposed CMP process, the efficiency uniformity of several BSGs with an aperture of 430 mm x 430 mm has been successfully controlled within an rms of 5%. The proposed CMP process is an effective method to improve the efficiency uniformity of large-aperture BSGs. Using the proposed CMP process, the requirement of the uniformity of the holographic ion beam etching process can be released in the realization of large-aperture BSGs. (C) 2014 Optical Society of America
引用
收藏
页码：1221 / 1227
页数：7
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