Modeling of fluid flow and heat transfer in a copper based heat sink application

With the trend towards increasing the speed of processors in smaller sized of computers, there has been considerable interest in heat sink technologies with higher levels of performance and further miniaturization. This work addresses the fundamental heat transfer augmentation question of how to design a copper-based heat sink, when the overall dimensions of the bottom plate or fan are specified. A three-dimensional finite-volume model has been developed and applied to investigate flow and conjugate heat transfer in the copper-based heat sink. The model was produced with the commercial program FLUENT, which allows this nonlinear, highly turbulent problem to be simulated using the k-epsilon turbulence model. The theoretical model developed is validated by comparing the model predictions with available experimental data. The thermal performance and temperature distribution for the heat sink were analyzed and a procedure for optimizing the geometrical design parameters based on less space occupation and more efficient heat transfer coefficient is presented. Several design examples with different types of cooling methods and manufacturing processes have been analyzed. The reliability and effectiveness in heat spreading of those has been compared. It has been shown that the copper-based heat sink with louvered fins (case No.3) has an optimum design configuration.