Molecular simulation of the contact angle of water droplet on a platinum surface

被引：0
|
作者：
Shi, Bo [1 ]
Sinha, Shashank [1 ]
Dhir, Vijay K. [1 ]
机构：
[1] Univ Calif Los Angeles, Dept Mech & Aerosp Engn, Boiling Heat Transfer Lab, Los Angeles, CA 90095 USA
来源：
Proceedings of the ASME Heat Transfer Division 2005, Vol 1 | 2005年 / 376-1卷
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D O I：
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中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
This paper presents a molecular simulation study of the contact angles of water droplets on a platinum surface for a range of temperatures. SPC/E and Z-P model are used for the waterwater and water-platinum potentials, respectively. The results show that the contact angle decreases with the increase of system temperatures and increases when the potential decreases. When the temperature is high enough, the contact angles drop to zero degrees. The results were compared with the argon-virtual solid wall and water-Aluminum results, a similar trend was found.
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页码：93 / 97
页数：5
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