Numerical Simulation of Thermoelasticity Problems on High Performance Computing Systems

被引：3
|
作者：
Sivtsev, Petr V. [1 ]
Vabishchevich, Petr N. [2 ]
Vasilyeva, Maria V. [1 ]
机构：
[1] North Eastern Fed Univ, Yakutsk 677000, Russia
[2] Nucl Safety Inst, Moscow 115191, Russia
来源：
FINITE DIFFERENCE METHODS, THEORY AND APPLICATIONS | 2015年 / 9045卷
关键词：
SCHEMES;
D O I：
10.1007/978-3-319-20239-6_40
中图分类号：
TP31 [计算机软件];
学科分类号：
081202 ; 0835 ;
摘要：
In this work we consider the coupled linear system of equations for temperature and displacements which describes the thermoelastic behaviour of the body. For numerical solution we approximate our system using finite element method. As model problem for simulation we consider the thermomechanical state of the ceramic substrates with metallization, which are used for the manufacturing of light-emitting diode modules. The results of numerical simulation of the 3D problem in the complex geometric area are presented.
引用
收藏
页码：364 / 370
页数：7
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