Physical failure analysis in semiconductor industry - challenges to microscopy

With the ongoing scaling-down of transistor features and interconnect dimensions and with the introduction of new processes and materials, physical failure analysis becomes more and more an essential task to exclude both yield-limiting process irregularities and reliability-related failures in the semiconductor industry. Advanced imaging tools and techniques are needed to ensure high manufacturing yield and product reliability. The application of scanning and transmission electron microscopy techniques, X-ray microscopy, as well as scanning probe microscopy for physical failure analysis is discussed.