Introduction to Fine Copper Wire Development

被引：0
|
作者：
Pan, Q. H. [1 ]
Tan, H. B. [1 ]
Yang, W. P. [1 ]
Dai, X. Z. [1 ]
Anderson, Harold [2 ]
Quah, Jerry [2 ]
机构：
[1] Leshan Phoenix Semicond Co Ltd, New Product Dev Dept, 27A W People Rd, Leshan, Sichuan, Peoples R China
[2] ON Semicond, Phoenix, AZ USA
来源：
IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY | 2006年
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D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The article presents the fine 20um (0.8 mil diameter) copper wire bonding development using SOT package as the test vehicle. The project scope covered fine copper wire bonding process capability study; reliability tests and electrical characterization; Cu-Al intermetallic compound (IMC) characterization and large scale manufacturability evaluation.
引用
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页码：376 / +
页数：2
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