Research of the performance of Al/Al2O3 substrate

被引：0

作者：

Peng, R ^{[1
]}

Zhou, HP ^{[1
]}

Ning, XS ^{[1
]}

Xu, W ^{[1
]}

Lin, YB ^{[1
]}

机构：

[1] Tsing Hua Univ, Dept Mat Sci & Engn, State Key Lab New Ceram & Fine Proc, Beijing 100084, Peoples R China

来源：

JOURNAL OF INORGANIC MATERIALS | 2002年 / 17卷 / 04期

关键词：

bonding; Al; die-casting-bonding Al2O3 substrates;

D O I：

暂无

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

After getting rid of Al2O3 film from the surface of melting Al, Al can wet and bond Al2O3 substrate perfectly. In this work, by die-casting-bonding process, in the temperautre range of 948similar to1098K and under N-2 atmosphere, Al/Al2O3 substrates were produced successfully, The performance of Al/Al2O3 substrates was investigated by SEM and mechanic testing equipment. The bonding strength of Al/Al2O3 measured is more than 15.94MPa.

引用

页码：731 / 736

页数：6

共 6 条

[1] DAVID RF, 1996, ELECT PACKING PR MAR, P51
[2] Diemer M, 1999, J AM CERAM SOC, V82, P2825, DOI 10.1111/j.1151-2916.1999.tb02163.x
[3] Intrater J., 1989, Machine Design, V61, P95
[4] Variation of contact angles with temperature and time in the Al-Al2O3 system
Jung, WY
Song, HS
Park, SW
Kim, DY
[J]. METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE, 1996, 27 (01): : 51 - 55
[5] NAGATA C, 1999, Patent No. 5965193
[6] SUN YS, 1976, IEEE T ELECTRON DEV, V23, P961, DOI 10.1109/T-ED.1976.18517

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