MicroDAC - A measurement technique for the determination of material properties at the micro- and nanoscale

被引:0
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作者
Keller, J
Vogel, D
Michel, B
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TH7 [仪器、仪表];
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0804 ; 080401 ; 081102 ;
摘要
Recent development of new electronics and microsystem devices, including 3D-integration, ultra thin chips, polymer electronics, high temperature electronics and MEMS/NEMS packaging call for thermo-mechanical material and component characterization for reliability assessment on micro- and nanoscale. The paper presents the digital image correlation method (DIC) for deformation measurement on the micro and nanoscale based on SPM scans. Application examples are referred to in-situ thermal loading of a gas sensor and microcrack evaluation by DIC based deformation fields.
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页码:433 / 440
页数:8
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