A Low-Temperature SU-8 Based Wafer-Level Hermetic Packaging for MEMS Devices

被引:19
|
作者
Zine-El-Abidine, Imed [1 ]
Okoniewski, Michal [2 ]
机构
[1] CMC Microsyst, Kingston, ON K7L 3N6, Canada
[2] Univ Calgary, Dept Elect & Comp Engn, Calgary, AB T2N 1N4, Canada
来源
关键词
Microelectromechanical devices; micromachining; packaging; wafer-scale integration; ENCAPSULATION;
D O I
10.1109/TADVP.2008.2006757
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
We have developed a novel all SU-8 packaging method for microelectromechanical system (MEMS) devices. The process is low temperature and low cost and it allows for nonhermetic as well as hermetic packaging. The nonhermetic package can be applied to sensors. The process flow is based on a partial and a full exposure of SU-8 negative resist using two masks. The underexposed region results in cross-linking of only a surface layer, while the underlying resist is not cross-linked and can be removed using SU-8 developer. By depositing a second SU-8 layer a sealed package for MEMS devices can be achieved. The packaging method provides any pattern and cavity clearance since it is solely based on lithography steps. The concept of the packaging method is introduced in this paper and then its practical validity demonstrated using Simulation and characterization results.
引用
收藏
页码:448 / 452
页数:5
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