Finite element Modeling for computer motherboard modal analysis

被引：0
|
作者：
Du, Pingan [1 ]
Yu, Yating [1 ]
Gan, Ezhong [1 ]
Li, Bo [1 ]
机构：
[1] Univ Elect Sci & Technol China, Sch Mechatron Elect Engn, Chengdu 610054, Sichuan, Peoples R China
来源：
2005 IEEE International Conference on Mechatronics and Automations, Vols 1-4, Conference Proceedings | 2005年
关键词：
modelling approach; Computational modal analysis; Experimental modal analysis; Computer motherboard;
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Computer is one of the most widely used electronics systems. During manufacturing, shipping, handing, and operation, it will be subjected to mechanical shocks and vibrations that may result in various failures. As a major component of a computer, motherboard has a considerable effect on the performance of a computer. Therefore, the prediction and improvement of the dynamic properties of the motherboard is of great significance. In this paper, the finite element modeling issues regarding the modal analysis of motherboard is addressed. The modeling approach is investigated extensively by means of computational and experimental modal analysis. A comparison of the modal parameters from both experiment and simulation shows the validity of the proposed approach. The effects of some model factors are also investigated.
引用
收藏
页码：2101 / 2105
页数：5
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