A study of thermo-mechanical reliability of lead-free PTH solder joints

被引：7
|
作者：
Nguyen, Jennifer [1 ]
Geiger, David [1 ]
Rooney, Dan [1 ]
Shangguan, Dongkai [1 ]
机构：
[1] Flextronics Int, San Jose, CA USA
来源：
SOLDERING & SURFACE MOUNT TECHNOLOGY | 2009年 / 21卷 / 02期
关键词：
Lead; Soldering; Joining processes; Waves;
D O I：
10.1108/09540910910947462
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Purpose - The purpose of this paper is to consider PTH solder joint reliability, particularly on the PTH solder joints with partial hole-fill and without pin protrusion. Also, the impact of voiding on the solder joint reliability is discussed. Design/methodology/approach - Thermal cycling tests for samples of different hole-fill percentages and voiding were conducted, and cross-sections of the PTH solder joints were performed to evaluate the solder microstructure, intermetallic formation, via hole-fill, and the condition of the PTH metallization and PCB dielectric prior to thermal cycling and at different times during thermal cycling. Findings - Different failure mechanisms were observed for solder joints with and without pin protrusion. PTH components with pin protrusion had better through hole-fill and less voids than PTH components without pin protrusion. Originality/value - The paper discusses in detail the effect of hole-fill percentage and voiding on PTH solder joint reliability.
引用
收藏
页码：39 / 47
页数：9
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