Picosecond laser ablation of transparent materials

被引:12
|
作者
Russ, Simone [1 ]
Siebert, Christof [2 ]
Eppelt, Urs [3 ]
Hartmann, Claudia [3 ]
Faisst, Birgit [2 ]
Schulz, Wolfgang [3 ]
机构
[1] TRUMPF Laser GmbH Co KG, Aichhalder Str 39, D-78713 Schramberg, Germany
[2] TRUPF Laser Systemtech Gmbh, D-71254 Ditzingen, Germany
[3] Fraunhofer Inst Lasertech, D-52074 Aachen, Germany
关键词
picosecond laser; ablation; glass; ultrashort pulse; rear side damage;
D O I
10.1117/12.2001991
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Processing of thin and ultra-thin glass displays is becoming more important in the fast increasing market of display manufacturing. As conventional technologies such as mechanical scribing followed by manual breaking mostly lead to bad edge quality and thus to a huge amount of reject, other processes like ablation processes [1] with picosecond lasers are getting more and more interesting. However processing with ultrashort pulsed lasers partially leads to unwanted effects which should be understood in a better way by means of intensive basic research. Therefore the ablation mechanism of ultrashort pulses on transparent materials was investigated in this research project. On the one hand the ablation mechanism was analyzed in a simulative way by means of rate equations on the other hand by laboratory experiments.
引用
收藏
页数:11
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