Influence of the P/M process on the microstructure and properties of WC reinforced copper matrix composite

被引:35
|
作者
Zhao, NQ [1 ]
Li, JJ [1 ]
Yang, XJ [1 ]
机构
[1] Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300072, Peoples R China
关键词
Polymer; Copper; Microstructure; Electron Microscope; Scanning Electron Microscope;
D O I
10.1023/B:JMSC.0000035321.65140.14
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The influence of powder metallurgy pressing procedure on 9% WC reinforced copper matrix composite was investigated, and the fracture surfaces of the composite in different states of process were observed by scanning electron microscope. The mechanism of fracture of the composite was analyzed. The results show that the pressing process apparently influences the properties and microstructure of the composite. The properties improved with processing sequence progression and the microstructure in terms of the distribution of WC particles in the composite became more uniform. The pressing process can improve the bonding at the interface between copper and WC particles and increases the critical stress for crack extension. (C) 2004 Kluwer Academic Publishers.
引用
收藏
页码:4829 / 4834
页数:6
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