Characteristics of eutectic and near-eutectic Zn-Al alloys as high-temperature lead-free solders (vol 31, pg 1691, 2020)

被引：0
|
作者：
Hasan, Mohammad Mehedi [1 ]
Sharif, Ahmed [2 ]
Gafur, M. Abdul [3 ]
机构：
[1] Swinburne Univ Technol, Fac Sci Engn & Technol, AD 223-03 John St, Hawthorn, Vic 3122, Australia
[2] Bangladesh Univ Engn & Technol BUET, Dept Mat & Met Engn, Old Acad Bldg,Zahir Raihan Rd, Dhaka 1000, Bangladesh
[3] Bangladesh Council Sci & Ind Res BCSIR, Pilot Plant & Proc Dev Ctr PP & PDC, Dr Qudrat E Khuda Rd, Dhaka 1205, Bangladesh
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2021年 / 32卷 / 01期
关键词：
D O I：
10.1007/s10854-020-04911-5
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The authors would like to add the following reference to Fig. 1.
引用
收藏
页码：1339 / 1339
页数：1
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共 31 条
  • [1] Characteristics of eutectic and near-eutectic Zn-Al alloys as high-temperature lead-free solders
    Hasan, Mohammad Mehedi
    Sharif, Ahmed
    Gafur, M. Abdul
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 31 (02) : 1691 - 1702
  • [2] Characteristics of eutectic and near-eutectic Zn–Al alloys as high-temperature lead-free solders
    Mohammad Mehedi Hasan
    Ahmed Sharif
    M. Abdul Gafur
    [J]. Journal of Materials Science: Materials in Electronics, 2020, 31 : 1691 - 1702
  • [3] Correction to: Characteristics of eutectic and near-eutectic Zn–Al alloys as high-temperature lead-free solders
    Mohammad Mehedi Hasan
    Ahmed Sharif
    M. Abdul Gafur
    [J]. Journal of Materials Science: Materials in Electronics, 2021, 32 : 1339 - 1339
  • [4] Solidification Behavior and Microstructural Evolution of Near-Eutectic Zn-Al Alloys under Intensive Shear
    Ji, S.
    Fan, Z.
    [J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2009, 40A (01): : 185 - 195
  • [5] Solidification Behavior and Microstructural Evolution of Near-Eutectic Zn-Al Alloys under Intensive Shear
    S. Ji
    Z. Fan
    [J]. Metallurgical and Materials Transactions A, 2009, 40 : 185 - 195
  • [6] Shear strength of the Zn–Sn high-temperature lead-free solders
    R. Mahmudi
    M. Eslami
    [J]. Journal of Materials Science: Materials in Electronics, 2011, 22 : 1168 - 1172
  • [7] High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders
    Che-Wei Chang
    Kwang-Lung Lin
    [J]. Journal of Electronic Materials, 2019, 48 : 135 - 141
  • [8] High-Temperature Mechanical Properties of Zn-Based High-Temperature Lead-Free Solders
    Chang, Che-Wei
    Lin, Kwang-Lung
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2019, 48 (01) : 135 - 141
  • [9] The characteristics of vibration fracture of Pb-Sn and lead-free Sn-Zn eutectic solders
    Chuang, CM
    Lui, TS
    Chen, LH
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (09) : 1232 - 1240
  • [10] The characteristics of vibration fracture of Pb-Sn and lead-free Sn-Zn eutectic solders
    C. M. Chuang
    T. S. Lui
    L. H. Chen
    [J]. Journal of Electronic Materials, 2001, 30 : 1232 - 1240
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