共 50 条
- [1] Measurements of Mixing Enthalpy for a Lead-Free Solder Bi-In-Sn System [J]. Journal of Electronic Materials, 2019, 48 : 8096 - 8106
- [3] Prediction of activities of all components in the lead-free solder systems Bi-In-Sn and Bi-In-Sn-Zn [J]. Journal of Alloys and Compounds, 2008, 457 (1-2): : 124 - 130
- [5] Strength of solder joints with lead-free Sn-Ag and Sn-Bi alloys [J]. PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, 2001, : 1047 - 1050
- [8] Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects [J]. Int. Conf. Electron. Pack., ICEP, 2017, (377-380):
- [9] Effects of Bi in Sn-Cu based lead-free solder alloys and interconnects [J]. 2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2017, : 377 - 380
- [10] Room-temperature indentation creep of lead-free Sn–Bi solder alloys [J]. Journal of Materials Science: Materials in Electronics, 2007, 18 : 1071 - 1078