Figures of merit to characterize the importance of on-chip inductance

被引:124
|
作者
Ismail, YI
Friedman, EG
Neves, JL
机构
[1] Univ Rochester, Dept Elect Engn, Rochester, NY 14627 USA
[2] IBM Server Grp, E Fishkill, NY 12533 USA
基金
美国国家科学基金会;
关键词
CMOS; high performance; inductance; interconnect; on-chip; transmission lines; VLSI;
D O I
10.1109/92.805751
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
A closed-form solution for the output signal of a CMOS inverter driving an RLC transmission line is presented, This solution is based on the alpha power law for deep submicrometer technologies, Two figures of merit are presented that are useful for determining if a section of interconnect should be modeled as either an RLC or an RC impedance. The damping factor of a lumped RLC circuit is shown to be a useful criterion. The second useful figure of merit considered in this paper is the ratio of the rise time of the input signal at the driver of an interconnect line to the time of Eight of the signals across the line, AS/X circuit simulations of an RLC transmission line and a five-section RC II circuit based on a 0.25-mu m IBM CMOS technology are used to quantify and determine the relative accuracy of an RC model, One primary result of this paper is evidence demonstrating that a range for the length of the interconnect exists for which inductance effects are prominent. Furthermore, it is shown that under certain conditions, inductance effects are negligible despite the length of the section of interconnect.
引用
收藏
页码:442 / 449
页数:8
相关论文
共 50 条
  • [1] Figures of merit to characterize the importance of on-chip inductance
    Ismail, YI
    Friedman, EG
    Neves, JL
    [J]. 1998 DESIGN AUTOMATION CONFERENCE, PROCEEDINGS, 1998, : 560 - 565
  • [2] The importance of inductance and inductive coupling for on-chip wiring
    Deutsch, A
    Smith, H
    Katopis, GA
    Becker, WD
    Coteus, PW
    Surovic, CW
    Kopcsay, GV
    Rubin, BJ
    Dunne, RP
    Gallo, T
    Knebel, DR
    Krauter, BL
    Terman, LM
    SaiHalasz, GA
    Restle, PJ
    [J]. ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 1997, : 53 - 56
  • [3] Performance criteria for evaluating the importance of on-chip inductance
    Ismail, YI
    Friedman, EG
    Neves, JL
    [J]. ISCAS '98 - PROCEEDINGS OF THE 1998 INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1-6, 1998, : A244 - A247
  • [4] Importance of on-chip inductance in designing RLC VLSI interconnects
    Awwad, FR
    Lammoshi, T
    Nekili, M
    [J]. ICM 2002: 14TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, 2002, : 177 - 180
  • [5] On the extraction of on-chip inductance
    Ismail, YI
    Friedman, EG
    [J]. JOURNAL OF CIRCUITS SYSTEMS AND COMPUTERS, 2003, 12 (01) : 31 - 40
  • [6] Grasping the impact of on-chip inductance
    Massoud, Yehia
    Ismail, Yehea
    [J]. IEEE Circuits and Devices Magazine, 2001, 17 (04): : 14 - 21
  • [7] Inductance Modeling for On-Chip Interconnects
    Shang-Wei Tu
    Wen-Zen Shen
    Yao-Wen Chang
    Tai-Chen Chen
    Jing-Yang Jou
    [J]. Analog Integrated Circuits and Signal Processing, 2003, 35 : 65 - 78
  • [8] On-chip inductance modeling and analysis
    Gala, K
    Zolotov, V
    Panda, R
    Young, B
    Wang, JF
    Blaauw, D
    [J]. 37TH DESIGN AUTOMATION CONFERENCE, PROCEEDINGS 2000, 2000, : 63 - 68
  • [9] Inductance analysis of on-chip interconnects
    Kundu, S
    Ghoshal, U
    [J]. EUROPEAN DESIGN & TEST CONFERENCE - ED&TC 97, PROCEEDINGS, 1997, : 252 - 255
  • [10] Inductance modeling for on-chip interconnects
    Tu, SW
    Shen, WZ
    Chang, YW
    Chen, TC
    Jou, JY
    [J]. ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 2003, 35 (01) : 65 - 78