Effect of Sodium Dodecyl Sulfate (SDS) on Copper Electrodeposition Behavior

The mechanism of the electrodeposition process of copper with the addition of sodium dodecyl sulfate (SDS) was investigated by cathodic sweep voltammetry and chronoamperometry in the acid sulfate system. The results show that the electrocrystallization process of copper conforms to the three-dimensional nucleation/growth mechanism of Scharitker-Hill. The addition of SDS makes the deposition potential shift positively and reduces the cathodic polarization. When the SDS concentration is 0.5 g/L, the electrocrystallization of copper in the potential region from -0.2 to -0.28 V conforms to progressive nucleation, the nucleation relaxation time is prolonged, and the nucleation rate is reduced. When the concentration of SDS is 1 g/L, the SDS structure changes from long chain to spherical micelle. When the potential is -0.2 V, the copper electrocrystallization proceeds in a progressive nucleation mode. When the copper is in the potential region from -0.23 to -0.28 V, the crystallization is converted into transient nucleation, the nucleation relaxation time is reduced, and the nucleation rate is accelerated.