Fundamental Study on High-quality Dicing Method for Semiconductor Package by Fiber Laser

Recently, the laser dicing method has been expected to replace a blade dicing method because of its high flexibility. However, in the laser dicing, the heat affected zone yielding heat damage should be reduced in order to prevent the deterioration of semiconductor devices consisting of silicon chip. Therefore, the reduction of heat affected zone was experimentally investigated by using cooled assist gas. It is clarified that the combination of nitrogen assist gas in the coaxial direction of laser beam and cooled assist gas from the rear side of cutting direction led to the better cutting results with low heat affected zone.