Projection moire for 3D inspection of printed circuit boards

被引：3
|
作者：
Kim, SW
Choi, YB
Oh, JT
机构：
来源：
THREE-DIMENSIONAL IMAGE CAPTURE | 1997年 / 3023卷
关键词：
projection moire topography; 3-D inspection; solder paste; printed circuit boards; phase-shifting;
D O I：
10.1117/12.269750
中图分类号：
TP31 [计算机软件];
学科分类号：
081202 ; 0835 ;
摘要：
We present a method of projection moire specially devised for the three-dimensional inspection of printed circuit boards. This method incorporates phase-shifting technique in analyzing moire fringes so as to achieve a fine resolution of 1 micron in height measurement. Further a synchronous grating translation scheme enhances the lateral measuring resolution by inherently removing the original pattern of the reference grating in resulting moire fringes. Finally we discuss the advantages of the proposed method using several measurement results performed on the various types of solder paste silk-screened on printed circuit boards.
引用
收藏
页码：129 / 138
页数：10
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