Solder bumping methods for flip chip packaging

被引：17
|
作者：
Rinne, GA
机构：
来源：
47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS | 1997年
关键词：
D O I：
10.1109/ECTC.1997.606176
中图分类号：
学科分类号：
摘要：
A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of these techniques, based on work at MCNC and Unitive Electronics Inc., are provided.
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页码：240 / 247
页数：8
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