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- [2] Surface chemistry of Si:H:Cl film formation by RF plasma-enhanced chemical vapor deposition of SiH2Cl2 and SiCl4 JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2003, 42 (10A): : L1119 - L1122
- [3] Surface Chemistry of Si:H:Cl Film Formation by RF Plasma-Enhanced Chemical Vapor Deposition of SiH2Cl2 and SiCl4 Shirai, H. (shirai@fms.saitama-u.ac.jp), 1600, Japan Society of Applied Physics (42):
- [5] Formation of Si:H:Cl films at low temperatures of 90-140°C by RF plasma-enhanced chemical vapor deposition of a SiH2Cl2 and H2 mixture JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2003, 42 (03): : 1173 - 1178
- [6] Formation of Si:H:Cl films at low temperatures of 90-140°C by RF plasma-enhanced chemical vapor deposition of a SiH2Cl2 and H2 mixture Shirai, H. (shirai@fms.saitama-u.ac.jp), 1600, Japan Society of Applied Physics (42):
- [10] Low-temperature Si epitaxy by photochemical vapor deposition with SiH2Cl2 Oshima, Takayuki, 1600, Publ by JJAP, Minato-ku, Japan (33):