Deployment of vapour chambers for electronic heat dissipation: state-of-the-art

被引：0

作者：

Chitnis, Swapnil ^{[1
]}

Dayal, Ram ^{[1
]}

Arora, Amit ^{[1
]}

机构：

[1] Malaviya Natl Inst Technol, Dept Mech Engn, JLN Marg, Jaipur 302017, Rajasthan, India

来源：

PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE | 2022年 / 236卷 / 16期

关键词：

Cooling system; vapour chamber; hotspot; passive two-phase heat transfer; Thermo-physical parameters; THERMAL PERFORMANCE EVALUATION; MICRO-GROOVED WICKS; CAPILLARY CHARACTERIZATION; HYDRAULIC PERFORMANCE; COMPOSITE WICKS; PIPE; FABRICATION; RESISTANCE; SINK; FLUX;

D O I：

10.1177/09544062221091464

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

Miniaturization and high performance are the two principal requirements of modern electronics. All commercial applications demand reliable performance at high operational efficiency for prolonged service life. In order to meet all these requirements, the cooling system should be able to handle large heat fluxes packed in compact spaces and take away the heat as soon as possible to avoid overheating of the chip. Phase change heat transfer devices can handle large heat fluxes on account of latent heating. Lately, vapour chambers (VCs) are found to be promising heat spreaders as they are passive two-phase heat transfer devices. They effectively eliminate the hotspots, transferring high heat fluxes with better efficiencies and offer lower thermal resistance compared to the conventional cooling techniques. A detailed review of the latest research and advancements in the field of VCs is presented in this paper, including the effect of different thermo-physical parameters on their performance. Finally, all the major findings are summarized, including the future scope of development in a systematic manner.

引用

页码：9316 / 9340

页数：25

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