Interface Microstructure and Thermal Stress of Diamond Brazing with Ag-Cu-Ti Filler

被引：0

作者：

Lu Jinbin ^{[1
,2
]}

Xu Jiuhua ^{[2
]}

机构：

[1] Zhongyuan Univ Technol, Sch Mat & Chem Engn, Zhengzhou 450007, Peoples R China

[2] Nanjing Univ Aeronaut & Astronaut, Nanjing 210016, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2009年 / 38卷 / 04期

关键词：

brazing; TiC; diamond; thermal stress;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A firm joint between steel base and diamond was realized by using Ag-Cu-Ti brazing diamond in vacuum. The interface between diamond and filler and carbide formed on the diamond surface was analyzed by using SEM, EDS, XRD and Raman Spectroscope. Results showed that carbide layer was formed as a result of the reaction between Ti and diamond, and discontinuous-lump-like TiC carbide with less than I gin on the surface of diamond appeared. There was almost no heat damage in the brazed diamond. The maximal tensile stress in the diamond located at the top reached 60 MPa, while the maximal compressive stress located at the bottom was 120 MPa. As a result, the metallurgical bonding was obtained between filler metal and diamond through the forming the serial of diamond-TiC-filler layer.

引用

页码：642 / 646

页数：5

共 10 条

[1] Chattopadhyay A.K., 1991, ANN CIRP, V40, P313
[2] FANG R C., 2001, SPECTROSCOPY SOLID, P342
[3] GUAN YC, 2005, DIAMOND ABRASIVES EN, P23
[4] Interfacial segregation of Ti in the brazing of diamond grits onto a steel substrate using a Cu-Sn-Ti brazing alloy
Li, WC
Liang, C
Lin, ST
[J]. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2002, 33 (07): : 2163 - 2172
[5] Meng WR, 2004, RARE METAL MAT ENG, V33, P771
[6] SUN F L, 2001, CHINESE J NONFERROUS, V11, P103
[7] WANG Q S., 2006, SUPERHARD MAT TOOLS, P24
[8] Xiao B., 2001, T CHINA WELDING I, V22, P23
[9] Role of the reaction product in the solidification of Ag-Cu-Ti filler for brazing diamond
Yamazaki, T
Suzumura, A
[J]. JOURNAL OF MATERIALS SCIENCE, 1998, 33 (05) : 1379 - 1384
[10] YANG S, 2002, VACUUM CRYOGENIC, V8, P90

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