Effects of thermal treatment on microstructure and microhardness of rapidly solidified Sn-Ag-Zn eutectic solder

被引：6
|
作者：
Wei, Chen [1 ]
Liu, Yongchang [1 ]
Yu, Liming [1 ]
Xu, Ronglei [1 ]
Yang, Kai [1 ]
Gao, Zhiming [1 ]
机构：
[1] Tianjin Univ, Coll Mat Sci & Engn, Tianjin Key Lab Adv Jointing Technol, Tianjin 300072, Peoples R China
来源：
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 2009年 / 95卷 / 02期
基金：
中国国家自然科学基金;
关键词：
LEAD-FREE SOLDER; INTERMETALLIC COMPOUND FORMATION; PHASE-EQUILIBRIA; ALLOYS; TEMPERATURE; RELIABILITY; JOINTS; NI;
D O I：
10.1007/s00339-008-4886-3
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The structural stability of rapidly solidified (about 10(4) K/s) Sn-3.7Ag-0.9Zn eutectic solder was explored by high-temperature annealing. For the as-cast solders, the applied fast cooling rate had a significant influence on the microstructure of the solders. The faster the applied cooling rates, the smaller the beta-Sn dendrites. After annealing at 473 K for 20 and 50 h, beta-Sn dendrites congregated together into bulk ones for minimizing the interfacial energy, and Ag3Sn intermetallic compounds (IMCs) as well as ternary Ag-Zn-Sn IMCs segregated on the grain boundary of the beta-Sn dendrites. It seems that the coarsening of the beta-Sn dendrites in the rapidly solidified specimen brought a significant softening during annealing of the explored Sn-Ag-Zn alloy. Finally, the beta-Sn dendrites vanished gradually with increase of the annealing period, which leads to a kind of softening.
引用
收藏
页码：409 / 413
页数：5
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