Microstructural analysis of lead-free solder alloys

Among the many issues related to the performance of lead-free solder alloys, the dependence of their mechanical properties on the microstructure and the stability of the microstructure stability are some of the most important issues. A comprehensive understanding of the process-microstructure-property relationships is essential. Toward that goal, a microtextural analysis is performed using orientation imaging microscopy (OIM) for alloy Sn-38Ag-0.7CII (wt pct) processed at four different temperatures. Sn-38Ag-0.7Cu is one of the most promising lead-free solder alloys that has shown superior mechanical properties to other candidate lead-free solder alloys. However, a comprehensive understanding of their microstructure and the dependence of microstructure on processing conditions are still lacking. In the present work, a detailed microstructure characterization with respect to phase compositions, grain size and size distributions, texture, and orientation relationships between various phases are performed. The measured microstructural features are correlated with the soldering temperatures.