Diode laser soldering using a lead-free tiller material for electronic packaging structures

被引：17
|
作者：
Chaminade, C. [1 ]
Fogarassy, E. [1 ]
Boisselier, D. [1 ]
机构：
[1] IREPA, LASER, F-67400 Illkirch Graffenstaden, France
来源：
APPLIED SURFACE SCIENCE | 2006年 / 252卷 / 13期
关键词：
laser; soldering; lead-free; thermal modelling; electronic packaging;
D O I：
10.1016/j.apsusc.2005.07.095
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
As of today, several lead-free soldering pastes have been qualified for currently used soldering process. Regarding the new potential of laser-assisted soldering processes, the behaviour of the SnAgCu soldering paste requires, however, new investigations. In the first part of this study, the specific temperature profile of a laser soldering process is investigated using a high power diode laser (HPDL). These experimental results are compared to a thermal simulation developed for this specific application. The second part of this work deals with the diffusion of the tin-based filler material through the nickel barrier using the information extracted from the temperature simulations. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码：4406 / 4410
页数：5
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