共 50 条
- [1] Finite element analysis of substrate warpage during die attach process PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, : 94 - 98
- [3] Finite element analysis of TSOP silicon die crack issue during molding process ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2006, : 231 - +
- [4] Finite element stress analysis of thin die detachment process FIFTH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, PROCEEDINGS, 2003, : 44 - 51
- [8] Finite element analysis and experimental investigations for improving precision in single point incremental sheet forming process International Journal of Material Forming, 2008, 1 : 121 - 124
- [9] Experimental Research and Finite Element Analysis of Progressive Collapse Resistance of RC 3RD INTERNATIONAL CONFERENCE ON APPLIED ENGINEERING, 2016, 51 : 1015 - 1020
- [10] Experimental research and finite element analysis of progressive collapse resistance of RC Wang, She L. (wsheliang@aliyun.com), 1600, Italian Association of Chemical Engineering - AIDIC (51):