Interfacial healing behavior of 2507 duplex stainless steel during hot compression bonding

被引：5
|
作者：
Li, Chuanzong [1 ]
Yu, Zhiyuan [1 ]
Lu, Hao [1 ]
机构：
[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Shanghai 200240, Peoples R China
来源：
MATERIALS LETTERS | 2022年 / 327卷
关键词：
Duplex stainless steel; Hot compression bonding; Microstructure; Recrystallization; Interfacial boundary migration; MICROSTRUCTURE EVOLUTION; DEFORMATION;
D O I：
10.1016/j.matlet.2022.133035
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, the hot compression bonding (HCB) behavior of 2507 duplex stainless steel was investigated at the temperature of 1000 degrees C and 1100 degrees C and in the strain from 0.1 to 0.7. It was revealed that there are three contact forms on the bonding interface of duplex stainless steel: ferrite/ferrite bonding interface, austenite/austenite bonding interface, and ferrite/austenite bonding interface. The diversified interfacial boundary migration (IBM) behaviors on the three different bonding interfaces are the key to achieving interfacial healing. Increasing strain and bonding temperature both promoted the IBM, but the latter's effect was more pronounced. The HCB joints with well-healed bonding interfaces exhibited the same tensile properties as base material.
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页数：4
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