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- [5] Experimental Study on the Use of PCM-based Heat Sink for Cooling of Mobile Devices EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 743 - 748
- [8] EXPERIMENTAL INVESTIGATION OF A PCM-BASED TOPOLOGY OPTIMIZED HEAT SINK FOR PASSIVE COOLING OF ELECTRONICS PROCEEDINGS OF THE ASME 2020 HEAT TRANSFER SUMMER CONFERENCE (HT2020), 2020,