Incorporation of Horizontal Fins into a PCM-Based Heat Sink to Enhance the Safe Operation Time: Applicable in Electronic Device Cooling

被引:26
|
作者
Mosavi, Amirhosein [1 ,2 ]
Mehdizadeh, Hossein [3 ]
Abbasian-Naghneh, Salman [4 ]
Kalbasi, Rasool [3 ]
Karimipour, Aliakbar [5 ]
Cheraghian, Goshtasp [6 ]
机构
[1] Ton Duc Thang Univ, Environm Qual Atmospher Sci & Climate Change Res, Ho Chi Minh City, Vietnam
[2] Ton Duc Thang Univ, Fac Environm & Labour Safety, Ho Chi Minh City, Vietnam
[3] Islamic Azad Univ, Najafabad Branch, Dept Mech Engn, Najafabad, Iran
[4] Islamic Azad Univ, Najafabad Branch, Dept Math, Najafabad, Iran
[5] Duy Tan Univ, Inst Res & Dev, Da Nang 550000, Vietnam
[6] Tech Univ Carolo Wilhelmina Braunschweig, Dept Civil Engn, D-38106 Braunschweig, Germany
来源
APPLIED SCIENCES-BASEL | 2020年 / 10卷 / 18期
关键词
PCM-based heat sink; safe operation time; horizontal fin; aspect ratio; PHASE-CHANGE MATERIAL; THERMAL MANAGEMENT; ENTHALPY METHOD; PERFORMANCE; SYSTEM;
D O I
10.3390/app10186308
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
In this study, the effect of the presence of horizontal fins on the safe operating time (SOT) of the PCM filled heat sink was examined. The effects of the number of horizontal fins, as well as fins length on SOT at different aspect ratios, was investigated. Horizontal fins, owing to their high thermal conductivity, cause uniformity in temperature distribution and improve the heat sink thermal conductivity (positive effect). Incorporating horizontal fins reduces the PCM volume fraction which consequently diminishes the ability of the heat sink to absorb the thermal energy (negative effect). The competition between the former effect and the latter determines the efficacy of adding horizontal fins in the PCM filled heat sinks. As the number of horizontal fins increases up to five, the positive effect is superior to the negative one which in turn enlarges the safe operation time. By the further increase in the number of fins, the negative effect prevailed over the positive effect and therefore the safe operation time diminished. As the heat sink aspect ratio increased, convection heat transfer efficacy becomes more apparent. In this case, it is recommended to use horizontal fins with shorter lengths so that the PCM movement is not disturbed.
引用
收藏
页数:15
相关论文
共 16 条
  • [1] Numerical optimization of a PCM-based heat sink with internal fins
    Levin, Peleg P.
    Shitzer, Avraham
    Hetsroni, Gad
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2013, 61 : 638 - 645
  • [2] Numerical investigation of a PCM-based heat sink with internal fins
    Shatikian, V
    Ziskind, G
    Letan, R
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2005, 48 (17) : 3689 - 3706
  • [3] Parametric analysis of a PCM-based heat sink for electronic device thermal management
    Khadem, Zahra
    Salari, Ali
    Naghdbishi, Ali
    Shakibi, Hamid
    Sardarabadi, Mohammad
    JOURNAL OF ENERGY STORAGE, 2023, 74
  • [4] Numerical investigation of a PCM-based heat sink with internal fins: Constant heat flux
    Shatikian, V.
    Ziskind, G.
    Letan, R.
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2008, 51 (5-6) : 1488 - 1493
  • [5] Experimental Study on the Use of PCM-based Heat Sink for Cooling of Mobile Devices
    Wong, H. E.
    Tan, F. L.
    Fok, S. C.
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 743 - 748
  • [6] A novel synthetic jet based heat sink with PCM filled cylindrical fins for efficient electronic cooling
    Arumuru, Venugopal
    Rajput, Kartik
    Nandan, Rakesh
    Rath, Pransenjit
    Das, Mihir
    JOURNAL OF ENERGY STORAGE, 2023, 58
  • [7] Experimental and numerical studies on performance of PCM-based heat sink with different configurations of internal fins
    Hosseinizadeh, S. F.
    Tan, F. L.
    Moosania, S. M.
    APPLIED THERMAL ENGINEERING, 2011, 31 (17-18) : 3827 - 3838
  • [8] EXPERIMENTAL INVESTIGATION OF A PCM-BASED TOPOLOGY OPTIMIZED HEAT SINK FOR PASSIVE COOLING OF ELECTRONICS
    Ho, Jin Yao
    Leon, Kai Choong
    PROCEEDINGS OF THE ASME 2020 HEAT TRANSFER SUMMER CONFERENCE (HT2020), 2020,
  • [9] An efficient reliability-based design optimization study for PCM-based heat-sink used for cooling electronic devices
    Debich, Bessem
    El Hami, Abdelkhalak
    Yaich, Ahmed
    Gafsi, Wajih
    Walha, Lassaad
    Haddar, Mohamed
    MECHANICS OF ADVANCED MATERIALS AND STRUCTURES, 2022, 29 (12) : 1661 - 1673
  • [10] EXPERIMENTAL STUDY OF PCM BASED HYBRID HEAT SINK FOR ELECTRONIC COOLING
    Nandan, R.
    Arumuru, V.
    Rath, P.
    Das, M. K.
    JOURNAL OF ENHANCED HEAT TRANSFER, 2022, 29 (03) : 1 - 15