Universal DSP module implemented by SMT - Area array packaging technology

被引：0
|
作者：
Jovanovic, D
Lutovac, MD
Djenic, R
机构：
来源：
1997 21ST INTERNATIONAL CONFERENCE ON MICROELECTRONICS - PROCEEDINGS, VOLS 1 AND 2 | 1997年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new universal digital signal processing (DSP) module is implemented by SMT - Area Array Packaging Technology. The new DSP module is designed to fulfilled reconfigurable requirements and short time-to-market and for low volume low-cost custom applications.
引用
收藏
页码：435 / 438
页数：4
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