New adhesives for temporary bonding and fabric lamination

被引：0
|
作者：
Ahmed, SU
机构：
来源：
1997 POLYMERS, LAMINATIONS, & COATING CONFERENCE, BOOKS 1 AND 2 | 1997年
关键词：
D O I：
暂无
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
New adhesives for temporary bonding of paper, fabric, nonwoven, and other substrates have been developed. The adhesives are water soluble/dispersible and can be used in the form of pellets, webs, and films for bonding applications, Because of their water solubility/dispersibility they find applications where adhesive removal is desired after initial use. For example, temporary coating of substrates for protection during machining or temporary lamination of fabric prior to garment assembly. Some of the adhesives are also insoluble in dry cleaning solvents which is ideal for fabric lamination for dry clean apparel or garments. Their properties, testing, and application characteristics are discussed.
引用
收藏
页码：317 / 319
页数：3
相关论文
共 50 条
  • [1] New adhesives for temporary bonding and fabric lamination
    Ahmed, SU
    1997 HOT MELT SYMPOSIUM, 1997, : 127 - 129
  • [2] ADHESIVES FOR FABRIC LAMINATION
    FRIES, JA
    JOURNAL OF COATED FABRICS, 1983, 12 (03): : 174 - 186
  • [3] ADHESIVES AND PROCESSES IN FABRIC LAMINATION
    FRIES, J
    ADHESIVES AGE, 1982, 25 (10): : 32 - 37
  • [4] ADHESIVES AND PROCESSES IN FABRIC LAMINATION.
    FRIES, JOHN
    1982, V 23 (N 10): : 32 - 37
  • [5] HOW HOT MELT ADHESIVES ARE USED FOR FABRIC BONDING
    BRAGOLE, RA
    ROSSITTO, C
    AMERICAN DYESTUFF REPORTER, 1971, 60 (03): : 49 - &
  • [6] High-performance temporary adhesives for wafer bonding applications
    Puligadda, Rama
    Pilialamarri, Sunil
    Hong, Wenbin
    Brubaker, Chad
    Wimplinger, Markus
    Pargfrieder, Stefan
    ENABLING TECHNOLOGIES FOR 3-D INTEGRATION, 2007, 970 : 239 - +
  • [7] The effect of laser irradiation on peel strength of temporary adhesives for wafer bonding
    Lee, Seung-Woo
    Lee, Tae-Hyung
    Park, Ji-Won
    Park, Cho-Hee
    Kim, Hyun-Joong
    Kim, Seung-Man
    Lee, Sung-Hun
    Song, Jun-Yeob
    Lee, Jae-Hak
    International Journal of Adhesion and Adhesives, 2015, 57 : 9 - 12
  • [8] High-temperature spin-on adhesives for temporary wafer bonding
    Brewer Science, Inc., 2401 Brewer Drive, Rolla, MO 65401
    不详
    不详
    J. Microelectron. Electron. Packag., 2007, 3 (105-111):
  • [9] The effect of laser irradiation on peel strength of temporary adhesives for wafer bonding
    Lee, Seung-Woo
    Lee, Tae-Hyung
    Park, Ji-Won
    Park, Cho-Hee
    Kim, Hyun-Joong
    Kim, Seung-Man
    Lee, Sung-Hun
    Song, Jun-Yeob
    Lee, Jae-Hak
    INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2015, 57 : 9 - 12
  • [10] Temporary adhesives for wafer bonding: Deep reactive ion etching application
    Belharet, Djaffar
    Dubreuil, Pascal
    Colin, David
    Mazenq, Laurent
    Granier, Hugues
    2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, : 20 - 26
12345