Silicon Photonic Multi-Chip Module Interconnects for Disaggregated Data Centers

被引：0
|
作者：
Abrams, Nathan C. [1 ]
Glick, Madeleine [1 ]
Bergman, Keren [1 ]
机构：
[1] Columbia Univ, Dept Elect Engn, New York, NY 10027 USA
来源：
2020 INTERNATIONAL CONFERENCE ON OPTICAL NETWORK DESIGN AND MODELING (ONDM) | 2020年
关键词：
Silicon Photonics; Multi-Chip Module; Interposer; 2.5D Integration; Optical Interconnects; Disaggregation;
D O I：
暂无
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
We present our development of 2.5D integrated multi chip module silicon photonic transceivers for disaggregated applications, such as big data and machine learning algorithms. Disaggregation of data center resources to improve application efficiency and performance can be achieved through photonic switching networks. Our four-channel transceiver provides the electro-optic interface between electrical data generation and photonic switching to enable disaggregation within data centers.
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页数：3
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