Mathematical Model of Adapted Ultrasonic Bonding Process for MEMS Packaging

被引：0
|
作者：
Funkendorf, Anastasiia [1 ]
Bortnikova, Viktoriia [2 ]
Maksymova, Svitlana [2 ]
Melnyk, Mykhaylo [3 ]
机构：
[1] Kharkiv Natl Univ Radio Elect, Dept Software Engn, Kharkiv, Ukraine
[2] Kharkiv Natl Univ Radio Elect, Dept Comp Integrated Technol Automat & Mechatron, Kharkiv, Ukraine
[3] Lviv Polytech Natl Univ, Dept Comp Aided Design, Lvov, Ukraine
来源：
2019 IEEE XVTH INTERNATIONAL CONFERENCE ON THE PERSPECTIVE TECHNOLOGIES AND METHODS IN MEMS DESIGN (MEMSTECH) | 2019年
关键词：
MEMS; packaging; ultrasonic bonding process; wafer-level packaging; factorial experiment;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the paper, approach to adaptation ultrasonic bonding process for MEMS WLP is proposed. The results of the welded joint of dissimilar plates simulation are presented. Based on them, dependency between quality of the welded joint and the technological parameter of the welding speed is given. Mathematical Model of Adapted Ultrasonic Bonding Process for MEMS Packaging is developed.
引用
收藏
页码：79 / 82
页数：4
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