Raytheon Signs Contract To Develop Nano-Thermal-Interface Materials

被引：0
|
作者：
Allegro, Kelly
机构：
来源：
MICROWAVES & RF | 2009年 / 48卷 / 08期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：22 / 22
页数：1
相关论文
共 50 条
  • [1] Raytheon signs UK ASTOR contract
    不详
    MICROWAVE JOURNAL, 2000, 43 (02) : 51 - 51
  • [2] Raytheon Signs $151 M Evolved SeaSparrow Missile Contract
    不详
    MICROWAVE JOURNAL, 2009, 52 (10) : 43 - 43
  • [3] Raytheon Wins Contract to Develop Next-generation Jammer Technology
    不详
    MICROWAVE JOURNAL, 2009, 52 (03) : 42 - 42
  • [4] Raytheon receives US Navy contract to develop AEHF SATCOM system
    不详
    MICROWAVE JOURNAL, 2004, 47 (01) : 39 - 39
  • [5] ESA signs materials science laboratory contract
    不详
    ESA BULLETIN-EUROPEAN SPACE AGENCY, 1999, (97) : 103 - 103
  • [6] Thermal Performance Characterization of Nano Thermal Interface Materials after Power Cycling
    Sun, Shuangxi
    Xin, Luo
    Zanden, Carl
    Carlberg, Bjorn
    Ye, Lilei
    Liu, Johan
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 1426 - 1430
  • [7] Thermal transport barrier in carbon nanotube array nano-thermal interface materials
    Qiu, Lin
    Scheider, Kimberly
    Abu Radwan, Suhaib
    Larkin, LeighAnn Sarah
    Saltonstall, Christopher Blair
    Feng, Yanhui
    Zhang, Xinxin
    Norris, Pamela M.
    CARBON, 2017, 120 : 128 - 136
  • [8] Thermal interface materials
    Chung, DDL
    JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, 2001, 10 (01) : 56 - 59
  • [9] Thermal interface materials
    D. D. L. Chung
    Journal of Materials Engineering and Performance, 2001, 10 : 56 - 59
  • [10] Thermal Interface Materials
    Chung, D. D. L.
    JOURNAL OF ELECTRONIC MATERIALS, 2020, 49 (01) : 268 - 270
12345