High conductivity of isotropic conductive adhesives filled with silver nanowires

被引：137
|
作者：
Wu, H. P.
Liu, J. F.
Wu, X. J. [1 ]
Ge, M. Y.
Wang, Y. W.
Zhang, G. Q.
Jiang, J. Z.
机构：
[1] Zhejiang Univ, Lab New Struct Mat, Dept Mat Sci & Engn, Hangzhou 310027, Peoples R China
[2] Zhejiang Univ, Anal & Testing Ctr, Hangzhou 310027, Peoples R China
[3] Zhejiang Sci Tech Univ, Ctr Anal, Hangzhou 310018, Peoples R China
来源：
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES | 2006年 / 26卷 / 08期
基金：
中国国家自然科学基金;
关键词：
novel adhesives; composites; mechanical properties of adhesives; silver nanowires;
D O I：
10.1016/j.ijadhadh.2005.10.001
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
As an alternative to lead-bearing solder, isotropic conductive adhesives (ICA) have been utilized for many years in microelectronic packaging. In this study, silver nitrate (AgNO3) as precursor, N-N-dimethylformamide (DMF) as solvent and reducing agent, preparing silver (Ag) nanowires in the nanoporous templates formed by the controlled hydrolysis and condensation of butyl titanate (Ti(OC4H9)(4)). The Ag nanowires were characterized by X-ray diffraction and transmission electron microscopy. An isotropic conductive adhesive (ICA) has been developed by adding Ag nanowires as conductive filler. Bulk resistivity and shear strength of the ICA are measured and compared with those of conventional ICA filled with micrometer-sized Ag particles (about 1 mu m) and nanometer-sized Ag particles (about 100 nm). It is found that the ICA filled with lower content of Ag nanowires exhibits lower bulk resistivity and higher shear strength than ICA filled with micrometer-sized Ag particles and nanometer-sized Ag particles. Possible conductive mechanisms of the ICA are discussed. (C) 2005 Elsevier Ltd. All rights reserved.
引用
收藏
页码：617 / 621
页数：5
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