Characterization of hot bonding of bi-metal C45/25CrMo4 by plane strain compression test

被引：0

作者：

Enaim, Mohammed ^{[1
]}

Langlois, Laurent ^{[1
]}

Zimmer-Chevret, Sandra ^{[1
]}

Bigot, Regis ^{[1
]}

Krumpipe, Pierre ^{[2
]}

机构：

[1] Design Mfg & Control Lab, Metz, France

[2] Tech Ctr Mech Ind, St Etienne, France

来源：

PROCEEDINGS OF 21ST INTERNATIONAL ESAFORM CONFERENCE ON MATERIAL FORMING (ESAFORM 2018) | 2018年 / 1960卷

关键词：

hot deformation bonding; plane strain compression test; normal contact pressure; surface expansion; TEMPERATURE;

D O I：

10.1063/1.5034859

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The need to produce multifunctional parts in order to conform to complex specifications becomes crucial in today's industrial context. This is why new processes are under study to develop multi-material parts which can satisfy this kind of requirements. This paper investigates the possibility of producing hot bonding of bi-metal C45/25CrMo4 parts by forging. This manufacturing process is a solid state joining process that involves, simultaneously, the welding and shaping of multi-material part. In this study, the C45/25CrMo4 bimetal was investigated. The forging is conducted at 1100 degrees C and the influence of reduction rate on microstructure and bonding was investigated. The bonding model is inspired from Bay's model. Following this model, two parameters govern the solid-state bonding at the interface between materials: normal contact pressure and surface expansion. The objective is to check the bonding quality under different pressure and surface expansion. To achieve this goal, the plane strain compression test is chosen as the characterization test. Finally, simulations and experiments of this test are compared.

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页数：6